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ESD9B3.3ST5G Transient Voltage Suppressors
Micro-Packaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium.
Specification Features http://onsemi.com
* * * * * * * * *
Low Capacitance 15 pF Low Clamping Voltage Small Body Outline Dimensions: 0.039 x 0.024 (1.0mm x 0.60mm) Low Body Height: 0.016 (0.4 mm) Stand-off Voltage: 3.3 V Low Leakage Response Time is < 1 ns IEC61000-4-2 Level 4 ESD Protection This is a Pb-Free Device
SOD-923 CASE 514AB
MARKING DIAGRAM
XM
Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
X M
= Specific Device Code Date Code
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating IEC 61000-4-2 (ESD) Contact Air PD RqJA TJ, Tstg TL Symbol Value 8.0 15 300 400 -55 to +150 260 Unit kV mW C/W C C
ORDERING INFORMATION
Device ESD9B3.3ST5G Package SOD-923 (Pb-Free) Shipping 8000/Tape & Reel
Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in.
(c) Semiconductor Components Industries, LLC, 2008
September, 2008 - Rev. 0
1
Publication Order Number: ESD9B3.3S/D
ESD9B3.3ST5G
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Capacitance @ VR = 0 V and f = 1.0 MHz IPP IT VC VBR VRWM IR IR VRWM VBR VC IT IPP I
V
Bi-Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
VRWM (V) Device ESD9B3.3ST5G Device Marking 2* Max 3.3 IR (mA) @ VRWM Max 1.0 VBR (V) @ IT (Note 2) Min 5.0 Max 7.0 IT mA 1.0 C (pF) Typ 15 VC Per IEC61000-4-2 (Note 3) Figures 1 and 2 See Below VC (V) @ IPP = 1 A Max Per 8 x 20 ms (Note 4) 10.5
* Rotated 270. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 3. For test procedure see Figures 3 and 4 and Application Note AND8307/D. 4. Surge current waveforms per Figure 5.
Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000-4-2
Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000-4-2
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ESD9B3.3ST5G
IEC 61000-4-2 Spec.
Test Voltage (kV) 2 4 6 8 First Peak Current (A) 7.5 15 22.5 30 Current at 30 ns (A) 4 8 12 16 Current at 60 ns (A) 2 4 6 8 I @ 60 ns 10% tP = 0.7 ns to 1 ns I @ 30 ns IEC61000-4-2 Waveform Ipeak 100% 90%
Level 1 2 3 4
Figure 3. IEC61000-4-2 Spec
ESD Gun
TVS
Oscilloscope
50 W Cable
50 W
Figure 4. Diagram of ESD Test Setup The following is taken from Application Note AND8308/D - Interpretation of Datasheet Parameters for ESD Devices. ESD Voltage Clamping
For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000-4-2 waveform. Since the IEC61000-4-2 was written as a pass/fail spec for larger
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 20 tP tr
systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D.
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
40 t, TIME (ms)
60
80
Figure 5. 8 X 20 ms Pulse Waveform
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ESD9B3.3ST5G
PACKAGE DIMENSIONS
SOD-923 CASE 514AB-01 ISSUE B
D -X- -Y- E
1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E HE L MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006
b
2X
0.08 (0.0032) X Y A
c
L HE
SOLDERING FOOTPRINT*
0.90 0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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ESD9B3.3S/D

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